INCOM 2015 - Call for Papers Deadline
From October 15, 2014 01:00 until October 15, 2014 23:00
The 2015 IFAC Symposium on Information Control in Manufacturing (INCOM 2015) will be held in Ottawa, Canada on 11-13 May 2015. This will be the 15th event in the rich tradition of triennial IFAC events in manufacturing sciences and information technologies. The general theme of INCOM 2015 is "Design and Manufacturing Technology for a Sustainable Economy". Sustainable economic development, while preserving the planet's resources, is a great challenge in the 21st century. The true achievement of efficient, green manufacturing systems depends crucially on real and significant progress in advanced technologies and innovative methodologies at all levels of design, management, and control of the manufacturing infrastructure. This conference will provide a remarkable opportunity for the academic and industrial communities to address new challenges, share solutions, and discuss future research directions in such areas as automation, advanced manufacturing, information and communication technologies. The agenda will include plenary speeches, invited/special sessions, industrial panel sessions, and funding agencies' panel sessions. Contributions are expected from academia, industry, and government institutions and agencies.
The symposium will address scientific challenges and issues in the fields of information and communication technologies, Intelligent Manufacturing Systems, robotics and autonomous systems, enterprise management and operation, system diagnosis and maintenance, service oriented architectures for the control of manufacturing, and integrated enterprise and virtual production networks.
IMPORTANT DATES (PROVISIONAL)
- Special/Invited Session proposals: 1 September 2014
- Regular paper submission: 15 October 2014
- Special/Invited Session paper submission: 15 November 2014
- Notification of acceptance: 16 January 2015
- Camera-ready and registration: 16 February 2015
For more information see: incom2015.org
Technical co-sponsorship by IEEE RAS