On 15 May, 2013
At Yinchuan, China
IEEE ICIA is the premier conference series presenting the state of the art and future perspectives of information and automation technologies, and it has been an event for researchers, industry experts, and academics to share ideas and experiences surrounding frontier technologies, breakthroughs and innovative solutions and applications. The IEEE ICIA 2013 Conference will be held from 26-28 August 2013 in Yinchuan, China, which is known for its glorious Western Xia culture since Song Dynasty (1000 years ago). Resting beside Yellow River and Helan Mountain, Yinchuan is a fantastic destination with all the best aspects of travel, including deserts, plains, forests, gullies and canyons as well as a unique mixed culture of Chinese, Islamic and remains of the Silk Road. The IEEE ICIA 2013 conference promises to be a great platform for researchers and scholars in the broad areas of information and automation from all over the world, with excellent technical and social programs. The IEEE ICIA 2013 conference invites high quality original research papers in broad areas of information and automation.
Contributed Papers: Papers are solicited in all areas of information and automation science and engineering. All papers must be submitted in PDF format consistent with the IEEE PDF Requirements for IEEE Xplore. The standard number of pages is 6 and the maximum page limit is 8 pages with extra charge for the 2 extra pages beyond the 6 pages. Please visit the website for more information. All papers accepted by ICIA 2013 will be indexed by EI and included in IEEE Xplore. Upon acceptance, authors will be required to register and present their papers. In addition to the technical sessions, specially invited Keynote Addresses from world class leading researchers and Special Invited Lectures on the state of the art in the emerging topics in information and automation will be included in the conference program.
Call for Papers Deadline: 15 May 2013
For more information see: icia2013.wordpress.com
Financially Co-Sponsored by IEEE RAS