WHC 2013 - IEEE World Haptics Conference
On behalf of the IEEE WHC 2013 Organizing and Steering Committee, I would like to invite you to the IEEE World Haptics Conference 2013, the 5th Joint Eurohaptics Conference and the IEEE Haptics Symposium (IEEE WHC 2013). As the general chair of the conference, it will be my great pleasure and honor to see you in Daejeon, Korea, on 14-18 April 14 2013.
The IEEE WHC 2013 will offer opportunities to share the most up-to-date scientific discoveries and innovative products. The ultimate objective is to advance our field of haptics through networking among academia, industry, and affiliated specialists; and to build mutual understanding among colleagues from all over the world.
The scientific program will provide participants with opportunities to exchange the latest information, ideas, and experiences in the field of haptics. Your important contributions of papers and poster presentations, as well as active participation in workshops, will make the event even more fruitful. Invaluable instructional lectures, workshops and tutorials will be offered from outstanding haptic experts.
A special industry session will be organized for this conference. Global IT leaders will share their recent findings as well as business insights through the industry session and exhibition.
I truly hope that you will take this chance to join us in Daejeon, to benefit from this exciting technical program, and to plunge into the wonders of the traditional cultures and customs in this hidden jewel of Asia. Great weather and delicious cuisine mixed with friendly faces and warm hospitality await you.
I am looking forward to meeting you in Daejeon on April 14 ~ 18, 2013. With your active participation and support, this conference will be a resounding success. I assure you that the event will be an academically enriching, socially enjoyable, and truly memorable experience for all delegates and guests.
Thank you very much.
General Chair of IEEE WHC 2013
For more information see: www.haptics2013.org
Financially Co-Sponsored by IEEE RAS